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March 4, 2024IMAPSource ProceedingsOpen Access

Reliability of Copper Sintered Interconnects under Extreme Thermal Shock Conditions

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Authors

SBSri Krishna BhogarajuFUFrancesco UgoliniFBFederico Belponer

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Bhogaraju et al. (2024) studied this question.

synapsesocial.com/papers/68e75ca9b6db6435876d415chttps://doi.org/10.4071/001c.94645
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Also Consider

Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application2024
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  3. 3Reliability Analysis of Cu Sintered Die-Attach for SiC Power Devices: Mechanical, Electrical, and Thermal Evaluation2024 · 2 citations
  4. 4Reliability analysis of large area sintered Cu interconnects based on simulation and thermal shock test2026
  5. 5Thermal Stability and Microstructural Evolution of Cu Joints with an Ultra-Thin Sintered Layer2026