Effect of nitric oxide annealing on the interface trap density near the conduction bandedge of 4H–SiC at the oxide/(1120) 4H–SiC interface

Nitric oxide postoxidation anneal results in a significant decrease of defect state density (Dit) near the conduction bandedge of n-4H–SiC at the oxide/(112̄0) 4H–SiC interface. Comparison with measurements on the conventional (0001) Si-terminated face shows a similar interface state density following passivation. Medium energy ion scattering provides a quantitative measure of nitrogen incorporation at the SiO2/SiC interface.