A novel mechanism called particle sputtering and deposition is proposed based on the facts that the arced contact morphology, mass transfer, and arc durations in the metallic phase and the gaseous phase undergo transition phenomena with increasing load current. The mechanism is used satisfactorily as an explanation of the material transfer process and the contact resistance degradation of Pd and Ag contacts during the breaking of dc circuits.
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Chen et al. (1994) studied this question.
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