A new transistor with two‐level metal electrodes is developed in order to allow for the automatic wire bonding process and at the same time to minimize the chip area. To meet these requirements, the second‐level electrodes are formed right above the active area of a conventional transistor by utilizing the PMP (planar metallization with polymer) technology (1) with PIQ (polyimide iso‐indroquinazolinedione) film as an insulating layer. PIQ is a thermally stable polyimide‐type resin specially synthesized by us for the semiconductor devices. Through several types of reliability tests, it is shown that the new transistor exhibits excellent reliability in its device characteristics, indicating that the new structure satisfies the stringent reliability and productivity requirements for transistors molded in plastics.
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Saiki et al. (1977) studied this question.
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