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We report on the thermal stability of sputter-deposited Cu∕304 stainless steel nanoscale multilayer films. For individual layer thickness of approximately 70nm, the layered morphology was stable up to 600°C with no significant change in the hardness. The stainless steel layer had a duplex bcc+fcc structure that was also preserved in annealed films. After annealing at temperatures of 650°C or higher, the hardness of these multilayer films decreased from 4.75to3.4GPa due to morphological evolution from layers to equiaxed grains and coarsening of the nanolayers.
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Zhang et al. (2007) studied this question.
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