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Wafer curvature measurements are a simple yet sensitive way to measure stress in thin films. A multibeam optical system designed for in situ monitoring makes it possible to monitor the evolution of thin film stress in real time in a variety of deposition and processing environments. Examples of stress measurements in epitaxial systems, polycrystalline films and hard coatings are discussed.
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Chason et al. (2003) studied this question.
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