Flip-Chip Interconnection Lumped-Electrode EADFB Laser for 100-Gb/s/ λ Transmitter

We have achieved the 100-Gb/s/λ operation of a flip-chip interconnection 1.3-μm lumped-electrode electroabsorption modulator integrated with a distributed feedback laser module for the first time. The flip-chip interconnection provides a flatter frequency response characteristic and a higher modulation bandwidth. Clear eye opening was achieved for 103-Gb/s nonreturn to zero and equalizer-free 56-GBd 4-pulseamplitude modulation operation after a 10-km single-mode fiber transmission.