Experimental study demonstrates high-sensitivity vacuum ultraviolet detection using buried-electrode boron nitride, indicating strong potential for fast and stable deep-UV imaging.
In this work, we fabricated a high-performance amorphous boron nitride vacuum ultraviolet (VUV) photodetector based on buried-electrode metal-semiconductor-metal structure for the first time. The device has a responsivity of 95.2 mA/W and an external quantum efficiency of up to 59.1% by improving carrier collection efficiency at 200 nm under a 20 V bias. At 300 K, the device exhibits a low dark current of 82 fA and a high specific detectivity of8.3 × 10^ 13Jones. The response range between 163 nm and 215 nm covers the VUV spectrum and the VUV reject ratio against 254 nm and 450 nm is4.2 × 10^ 4and7.2 × 10^ 7, respectively. Even at 500 K, the device exhibits a dark current of only 1.2 pA and high responsivity, demonstrating excellent long-term stability and reliability. Furthermore, an8 × 8-pixel array composed of the photodetectors achieved stable and rapid (< 1 ms) VUV imaging. These findings demonstrate the outstanding performance of the photodetector and the potential applications of combining buried electrode structures with other ultra-wide bandgap semiconductors.
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Liu et al. (2024) studied this question.
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