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September 1, 1992Journal of Electronic Packaging

State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment

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ABAvram Bar‐CohenIntel (United States)

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Avram Bar‐Cohen (1992) studied this question.

synapsesocial.com/papers/6a9789cc2855ae6cf374bbfb https://doi.org/10.1115/1.2905450

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