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September 2, 2026Journal of Welding and JoiningOpen Access

Thermomechanical Reliability of SAC/SB Mixed Solder Containing Sn-58Bi Eutectic Solder

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Authors

YBYi Hyeon BaekSKSeung Hyeon KangJKJong‐Min Kim

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Overview

Comparative testing demonstrates improved thermal shock resistance and bonding strength in SAC/Sn-58Bi mixed solder joints, indicating enhanced thermomechanical reliability for electronics.

Key Points

  • To evaluate the thermomechanical reliability and mechanical bonding behavior of Sn-3.0Ag-0.5Cu (SAC) mixed with Sn-58Bi (SB) solder joints compared to standard SAC joints under cyclic thermal stress.
  • Conducted thermal shock testing across 1,000 cycles with temperatures alternating between -55 °C and 125 °C.
  • Assessed mechanical integrity before and after thermal shock using solder ball shear and microhardness testing.
  • Analyzed microstructural evolution, interfacial intermetallic compound (IMC) layer growth, and fracture mechanisms.
  • SAC/SB mixed solder joints achieved higher baseline shear strength and microhardness than unmixed SAC solder joints.
  • Following 1,000 thermal shock cycles, SAC/SB mixed joints experienced significantly lower reductions in shear strength and microhardness relative to SAC joints.
  • Microstructural analysis revealed that precipitation hardening and dispersion strengthening from Bi-rich, Ag3Sn, and Cu6Sn5 IMC phases suppressed internal coarsening and limited interfacial IMC layer growth in SAC/SB joints.

Cite This Study

Baek et al. (2026) studied this question.

synapsesocial.com/papers/6a97e25ec562ede874ec6786https://doi.org/10.5781/jwj.2026.44.4.1
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