A photosensitive composite resist having electrical properties has been developed for the direct photopatterning of electrically conductive microcomponents. This composite material is based on the dispersion of silver nanoparticles into the SU‐8 photopolymer, an insulating negative‐tone photoresist. Electrical and optical characterizations reveal a wide range of electrical conductivity of the composite structures depending of the filler load, and a lateral resolution better than 5 μm.
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Jiguet et al. (2004) studied this question.
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