Answers are grounded in this paper and cite their sources.
Optical interconnection through stacked silicon foundry complementary metal-oxide-semiconductor (CMOS) circuitry has been demonstrated at a data rate of over 40 Mb/s with an open eye diagram. The system consists of a 0.8-μm transmitter and receiver realized in foundry digital CMOS. The use of digital CMOS enables on-chip integration with more complex digital systems, such as a microprocessor. Two layers of these circuits were integrated with thin-film InP-based light emitting diodes and metal-semiconductor-metal photodetectors operating at 1.3 μm (to which the silicon is transparent) to enable vertical optical through-Si-communication between the stacked silicon circuits.
No takes yet. Share an insight, caveat, or question.
Vendier et al. (1998) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: