Crack mechanism correlated with Sn grain orientations on Ni metal surface subjected to 1000 thermal shocks

With the rapid development of 3D packaging, it is of great practical significance to understand the failure mechanism of solder joints in heterogeneous integration devices. In this study, the grain orientation and microstructure evolution of SAC305 solder joints were investigated in thermal shock tests for fan-out wafer level packaging. The heterogenous evolution of microstructure in Sn-3Ag-0.5Cu (SAC305) solder joints was investigated using electron backscattered diffraction (EBSD) and nanoindentation analysis. When the thermal shock reaches 1000 cycles, the local deformation caused the heterolattices in the joint to rotate toward the corners due to the thermal expansion. During deformation, sub-grain formation is accompanied by an increase in dislocations, the accumulation of plastic slip, and the activation of slip systems. The energy stored by this deformation is released in the form of cracks. The work in this paper provides new insights into the early stages of grain orientation, microstructural deformations and the accumulation of stored energy associated with these deformations, providing a scientific basis for the application and failure analysis of large size fan-out welded joints in complex working conditions.