What does this research mean for the field?

In corrugated microchannels, increasing wall temperature and inlet velocity accelerates vapor-slug development and enhances thermal transport, yielding up to a 139% increase in heat-transfer coefficient that outweighs the associated hydraulic penalty. Novelty: ClaimNovelty.INCREMENTAL. Consensus alignment: ConsensusAlignment.NEUTRAL.

What question did this study set out to answer?

Investigate vapor bubble growth, vapor-slug evolution, and overall thermal-hydraulic performance during water flow boiling inside a corrugated microchannel using a phase-field framework.

September 5, 2026Heat Transfer

Phase‐Field Numerical Investigation of Bubble Growth During Flow Boiling in a Corrugated Microchannel

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Authors

JJJawed Ahmed Jamali

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Overview

Numerical simulation demonstrates up to 139% heat transfer enhancement during flow boiling in corrugated microchannels, indicating superior cooling potential for high-power electronics.

Key Points

Investigate vapor bubble growth, vapor-slug evolution, and overall thermal-hydraulic performance during water flow boiling inside a corrugated microchannel using a phase-field framework.
Simulated two-phase interfacial dynamics and heat transfer during water flow boiling using a phase-field numerical model.
Evaluated operating parameters across three wall temperatures (378.15, 381.15, and 383.15 K), contact angles, inlet velocities (0.073, 0.146, and 0.290 m/s), and surface-tension coefficients (0.0400, 0.0500, and 0.0589 N/m).
Demonstrated a morphological transition from localized vapor embryos to elongated vapor slugs driven by evaporation, flow deformation, surface tension, and channel confinement.
Achieved an increase in the heat-transfer coefficient corresponding to an enhancement of approximately 139%, alongside thermal performance factor increases from 1.00 to 1.33 and 1.53 (a maximum improvement of 53%).
Showed that while pressure drop increased with inlet velocity and slug development, the resulting heat-transfer improvements outweighed the hydraulic penalty.

Cite This Study

Jawed Ahmed Jamali (2026) studied this question.

synapsesocial.com/papers/6a9bd4436b95aff0620ebcf0 https://doi.org/10.1002/htj.70360

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September 5, 2026Heat Transfer

Phase‐Field Numerical Investigation of Bubble Growth During Flow Boiling in a Corrugated Microchannel

View Full Paper

Ask AI

Bookmark

Authors

JJJawed Ahmed Jamali

Discussion

Member takes

Overview

Numerical simulation demonstrates up to 139% heat transfer enhancement during flow boiling in corrugated microchannels, indicating superior cooling potential for high-power electronics.

Key Points

Investigate vapor bubble growth, vapor-slug evolution, and overall thermal-hydraulic performance during water flow boiling inside a corrugated microchannel using a phase-field framework.
Simulated two-phase interfacial dynamics and heat transfer during water flow boiling using a phase-field numerical model.
Evaluated operating parameters across three wall temperatures (378.15, 381.15, and 383.15 K), contact angles, inlet velocities (0.073, 0.146, and 0.290 m/s), and surface-tension coefficients (0.0400, 0.0500, and 0.0589 N/m).
Demonstrated a morphological transition from localized vapor embryos to elongated vapor slugs driven by evaporation, flow deformation, surface tension, and channel confinement.
Achieved an increase in the heat-transfer coefficient corresponding to an enhancement of approximately 139%, alongside thermal performance factor increases from 1.00 to 1.33 and 1.53 (a maximum improvement of 53%).
Showed that while pressure drop increased with inlet velocity and slug development, the resulting heat-transfer improvements outweighed the hydraulic penalty.

Cite This Study

Jawed Ahmed Jamali (2026) studied this question.

synapsesocial.com/papers/6a9bd4436b95aff0620ebcf0 https://doi.org/10.1002/htj.70360

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