Thermal stability of Ir/polycrystalline-Si structure for bottom electrode of integrated ferroelectric capacitors

Ir films deposited on polycrystalline silicon (poly-Si), with and without barrier layer, were annealed and the thermal stability was investigated to check the feasibility of the structure for bottom electrode of integrated ferroelectric capacitors. Ir did not form silicide up to 700 °C and did not get oxidized up to 550 °C. It was found that Ir prevented diffusion of oxygen through it when annealed at 700 °C. Ir/poly-Si is believed to be most promising for bottom electrode structure from the results.