The feasibility of using silicon shadow masks to delineate fine linewidth grid patterns in MIS - Inversion Layer solar cells has been demonstrated. The masks have been prepared by anisotropically etching V-grooves into one surface of a silicon wafer, while simultaneously thinning the wafer by etching from the back surface. These masks have been used in a simple procedure to fabricate MISIL solar cells on 2.5 Ωcm, Czochralski silicon substrates with active area conversion efficiencies up to 15.1%.
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Camporese et al. (1981) studied this question.
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