Enhancement of Mask Selectivity in SiO2 Etching with a Phase-Controlled Pulsed Inductively Coupled Plasma

We developed a new method to enhace the photoresist selectivity in SiO2 etching by modulating both the source and bias powers and by controlling the phase difference between the modulation functions. Enhancement of mask selectivity was observed in the pulse plasma, especially in the out-phase condition. To understand the heavy polymerization in the out-phase pulse plasma, we analyzed the ion energy distributions of CF x +(x=1, 2, 3) ions using the energy-spectroscopic quadrupole mass spectrometer (QMS) and measured the waveforms of the bias power with a high-voltage probe which was connected directly to the wafer. Two distinct plasma potential distributions were obtained in the pulse plasma and the dc bias voltage (V DC) was maximum in the out-phase condition. The heavy polymerization in the out-phase condition was explained as a result of high V DC. We also investigated the emission intensity of the C2 (516.5 nm) line, and found that C2 species were precursors of the polymerization and contributed to the heavy polymerization in the out-phase condition.