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An assessment of the phase stability of thermally conductive pastes using both accelerated off-line centrifuge testing and functional testing with high-performance multichip modules is presented. The formulations used to improve the phase stability of thermally conductive pastes exposed to thermomechanical stressing associated with temperature variations during power cycling are shown. The pastes derived from the formulations were characterized and functionally tested. Particle surface modification, materials, and milling are discussed.>
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Anderson et al. (1990) studied this question.
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