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The techiques for determining the capacitance of embedded interconnects in an MCM-D MCM (multichip module) are compared. The error is estimating this capacitance in generally the greatest contributor to the overall error in determining the impedance of interconnects and discontinuities. Using in situ calibration microwave characterization of various MCM interconnects fabricated using an alumina on polyimide MCM-D process is reported.>
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Lipa et al. (1993) studied this question.
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