Indium tin oxide (ITO) films were prepared with relatively high deposition rate by rf magnetron sputtering under an applied external dc magnetic field. The films with resistivity as low as 2×10−4 Ω cm and average transmittance above 85% at wavelengths between 400 and 800 nm were able to form on the substrates at temperatures below 140 °C by using a target composition of 95 wt. % In2O3–5 wt. % SnO2. The characteristic features of the ITO films deposited on low-temperature substrates were their high carrier concentration and relatively low mobility. It was found that the use of a 95 wt. % In2O3–5 wt. % SnO2 target is better than that of a 90 wt. % In2O3–10 wt. % SnO2 target for deposition on low-temperature substrates, while the use of a 90 wt. % In2O3–10 wt. % SnO2 is desirable for deposition on substrates of high temperatures, about 350 °C. It was also found that the resistivity of the ITO films deposited on low-temperature substrates can be lowered by heat treatment at 400 °C in either a vacuum or nitrogen gas. After heat treatment at 400 °C in air, the magnitude of the resistivity of the ITO films increased several times. The resistivity after heat treatment in air was easily regained to the as-deposited state by sequential heat treatment at 300–400 °C in hydrogen gas.
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Nanto et al. (1988) studied this question.
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