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A high-speed hybrid-integrated two-channel laser diode (LD) array module has been fabricated using a silica-based planar lightwave circuit (PLC) platform. A laser diode array was flip-chip bonded on a PLC platform using AuSn solder bumps. The module showed a wide 3 dB bandwidth of 10 GHz, which is wide enough for operation at 10 Gbit/s.
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Mino et al. (1996) studied this question.
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