Effects of Surface Orientation on the Performance of Idealized III–V Thin-Body Ballistic n-MOSFETs

Ballistic on-currents of thin-body n-channel metal-oxide-semiconductor field-effect transistors (n-MOSFETs) are compared across group IV (Si, Ge) and III-V (InAs, In0.5Ga0.5As, GaAs, GaSb) materials for different body thickness values, surface orientations, and transport directions under several idealization assumptions. Previous simulation studies have shown that, as oxide capacitance increases, typical III-V channels with (100) surface perform worse than Si in the ballistic limit due to the degraded density-of-states (DOS). In this letter, simulation results based on tight-binding band structure calculations verify a recent proposal that confined III-V n-MOSFETs with small Γ-L separations overcome the DOS bottleneck and deliver high injection velocities, boosting on-current performance. By using the quantized L-valleys, GaSb with (100) or (111) surface orientations shows the best ballistic performance, outperforming all other materials. Although GaAs (100) and InAs or In0.5Ga0.5As with any surface orientation suffer from the DOS bottleneck, GaAs (111) gives higher ballistic on -currents than Si does.