Fabrication and Characterization of Polymer-Enhanced TSVs, Inductors, and Antennas for Mixed-Signal Silicon Interposer Platforms

This paper demonstrates the fabrication and high-frequency characterization of polymer-enhanced technologies for a mixed-signal silicon interposer platform. First, the fabrication of 60-μm-diameter and 285-μm-tall photodefined polymer-embedded vias is demonstrated. Their losses are extracted using L-2L and open-short de-embedding techniques up to 30 GHz followed by parasitics extraction. Moreover, eye-diagram measurements are demonstrated for the vias at 10 Gb/s. Second, the fabrication and impedance extraction of 65-μm-diameter and 285-μm-tall photodefined polymer-enhanced coaxial vias are demonstrated. Finally, utilizing the photodefined polymer-enhanced silicon interposer technology, high-performance inductor and antenna are demonstrated over polymer wells.