Thermal Properties of Kenaf-Filled Chitosan Biocomposites

Kenaf filled chitosan biocomposites have been prepared via solution blending method. 0.1 M acetic acid was used as diluent. Five types of biocomposites with different compositions of kenaf fiber by weight designated as (CH, CH7, CH14, CH21, and CH28) were prepared. Differential Scanning Calorimetry (DSC) and thermogravimetric analysis (TGA) were performed to study various thermal properties of the biocomposites. It was found that the biocomposites have undergone several decomposition stages over a range of temperatures as revealed by TGA thermograms, with CH exhibited highest mass loss as compared to other composites. From the DSC thermogram, incorporation of kenaf dust into chitosan has reduced the thermal stability of the chitosan film. The reduction is proportionate to the amount of kenaf dust added and was attributed to the formation of inter- and intrahydrogen bonding between amine groups of chitosan matrix and hydroxyl methyl groups of kenaf fiber.