The effect of pad surface roughness on SiO 2 removal rate was investigated using four different slurries containing ceria (CeO 2 ) powders of different crystallite sizes and mean particle sizes. A clear maximum was observed in the dependence of removal rate on pad surface roughness. The four ceria slurries showed a peak in blanket wafer removal rate against pad surface roughness R a . The peak moved toward larger R a values with decreasing ceria crystallite size. The removal rate was strongly influenced not only by pad surface roughness but also by the crystallite size of ceria in the slurry.
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Yoshida et al. (2006) studied this question.
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