Answers are grounded in this paper and cite their sources.
A spot-size converted Fabry-Perot laser diode (LD) was flip-chip bonded to a silica-terraced planar lightwave circuit (PLC) platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light-current characteristics, it was discovered that the silica terrace itself is not a strong thermal barrier, but the encapsulation of the integrated LD with an index-matching polymer resin more or less deteriorates the heat dissipation.
No takes yet. Share an insight, caveat, or question.
Kim et al. (2005) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: