Electrical properties of CeO 2 films prepared by reactive dc sputtering on Si(100) substrate with and without the incorporation of a thin barrier layer were investigated. X-ray diffraction spectra revealed that without the thin barrier layer, single-crystal CeO 2 is formed on Si(100) substrate. At an equivalent oxide thickness of 2.8 nm, CeO 2 films exhibit a leakage current which is four orders of magnitude lower than that of the conventional SiO 2 film at an applied bias of 2 V. Only negligible stress-induced leakage current is observed after high field stressing. The incorporation of the thin silicon nitride buffer layer, however, degraded the crystalline structure of CeO 2 , accompanied by deteriorated electrical properties such as leakage current and fixed charges. CeO 2 film without the barrier layer is thus attractive as the high dielectric constant gate insulator for future ultralarge scale integration devices.
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Pan et al. (2001) studied this question.
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