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In this letter, a novel hetero-stacked TFET (HS-TFET) is experimentally demonstrated and optimized for the first time, which can effectively suppress the subthreshold slope (SS) degradation without leakage current increase through self-adaptively current replenishing with bandgap engineering, greatly alleviating the critical issue of high average SS in conventional TFETs. Based on CMOS-compatible technology, the fabricated HS-TFETs of vertically stacked Si-Si1-xGexsource can experimentally achieve superior performance with nearly constant SS over five decades of drain current, high Ion (~14μA/μm @ VDS = -1 V), and large Ion/Ioffratio (~107). The proposed device with high process compatibility shows great potentials for future ultra-low power applications.
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Zhao et al. (2017) studied this question.
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