High temperature thermoplastic polyamide‐imides were prepared from a new series of aromatic diamines containing the diphenylsulfone unit and alternatively, oxydiphenyl and diphenylisopropylidene units. The polymers were prepared in their completely imidized form by using a facile in situ chemical imidization reaction which offers several advantages over the conventional thermal imidization process. The sulfone‐based polyamide‐imides exhibited an excellent combination of moldability, thermal stability, mechanical properties and solvent resistance. Analysis of the properties of these polymers in terms of structural variations permits a useful correlation of the effect of various structural units on performance. The polar diphenyl sulfone and amide‐imide units increase the glass transition temperature and improve solvent resistance while the oxydiphenyl and diphenylisopropylidene units improve thermoplasticity. Sulfone ether diamine polyamide‐imide (VI) offers the best combination of high temperature performance and moldability.
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Kwiatkowski et al. (1974) studied this question.
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