Packaging Technology for III-V Photonic Devices and Integrated Circuits

Semiconductor device packages provide mechanical protection, an electrical interface between their chips and the outside world, a means of removing heat, and in the case of photonic devices, a means of coupling the photons to or from their detectors or source chips. Because III-V devices are often used for their optical properties or their high-frequency characteristics, or both, this paper focuses on optical and electrical interfaces rather than on the mechanical and thermal interfaces.