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Pulse plating has previously been reported to improve the properties of nickel and nickel alloy deposits. Typically, focus has been on properties such as grain size, hardness and smoothness. When pulse plating is to be utilised for microtechnologies such as microelectromechanical systems (MEMS), internal stress and material distribution are even more important. With baths based upon nickel chloride, and nickel and cobalt chlorides, pulse reversal plating of both pure nickel and nickel–cobalt alloys has been used to fabricate tools for microinjection moulding. Pulse reversal plating of ternary soft magnetic alloys, comprising 45–65%Co, 15–35%Fe and 15–35%Ni, is also reported.
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Peter Torben Tang (2007) studied this question.
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