Various samples studied for their electrical behavior in the previous paper are here examined in detail by microstructural and microanalytical techniques. While several microstructural features are observed, the presence of “thick boundaries” (an amorphous silica‐rich phase that surrounds grain boundaries and forms a continuous network) appears to be the principal feature responsible for the grain‐boundary effect. Such features are absent from samples prepared with nearly silicon‐free materials, for which the grain‐boundary effect is also virtually absent.
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Gerhardt et al. (1986) studied this question.
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