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In this work, we demonstrate vertical GaN pn-diodes for high voltage applications initially grown and processed on 4” sapphire substrates and then transferred to 4” tungsten substrates to achieve a fully vertical conduction path. Laser lift-off was used to separate the GaN-membrane device structures from the initial sapphire substrate. The diodes show improved forward conduction after the transfer process with on-state resistance reduced from1.52~± ~0.05mΩ ·cm2 to1.15~± ~0.05mΩ ·cm2 and the blocking strength is not heavily compromised with its mean value reduced from1015~± ~47V to988~± ~57V. High device yields of the membrane transfer procedure underscores this cost-competitive vertical GaN device technology for high-power applications without the need of expensive GaN substrates.
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Brusaterra et al. (2025) studied this question.
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