EV Group (Austria)

Recent papers from EV Group (Austria)

1. Innovative Digital Patterning by LITHOSCALE® XT for UHD FO WLP and HD PLP Required in 3D IntegrationIMAPSource Proceedings · 2025
2. TEOS and thermal oxide low temperature direct wafer bonding dynamicsJapanese Journal of Applied Physics · 2025
3. Surface activated Cu/SiO2 hybrid bonding for room temperature 3D integrationJapanese Journal of Applied Physics · 2025
4. Vertical GaN-on-Tungsten High Voltage pn-Diodes From Sapphire-Grown GaN MembranesIEEE Electron Device Letters · 2025
5. Wafer-to-Wafer Bonding for Advanced Manufacturing Nodes2024
6. Modulation of post-fracture roughness with induced shear stress in the smart cut processJournal of Applied Physics · 2024
7. EOT Scaling Via 300mm MX2 Dry Transfer - Steps Toward a Manufacturable Process Development and Device Integration2024
8. 0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatures with SiCN Bond Layer2024
9. IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism2024
10. 300 nm Pitch W2W HBI for CFET and 3D DRAM Through Module Co-optimization2024
11. Ultra High Density RDL Patterning of High–Resolution Dielectrics by Maskless Exposure Technology for High Performance Computing and Artificial Intelligence2024
12. Multiphysics Overlay Modelling of Monolithic 3D Fusion and Hybrid Bonding Processes2024
13. Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers2024
14. Development of UV-curable molding materials with minimum die-shift for FOWLP/FOPLP2024
15. Novel Inorganic IR Release Process for High Temperature W2W and D2W Integration2024
16. Investigation on the use of Al-Ge eutectic bonding in the structure part of a multilayer stacked MEMS device2024
17. Semiconductor Traceability: Die Annotations Patterning by Maskless Exposure Technology2024
18. Inkjet coating combined with nanoimprinting for complex 3D patterns with progressive height increase and low residual layer2024
19. Maskless exposure of die annotations and image sensor patterns employing 7th generation RGB resists2024
20. Characterization and mitigation of local wafer deformations introduced by direct wafer-to-wafer bonding2024