Maskless exposure of die annotations and image sensor patterns employing 7th generation RGB resists

High–volume–capable Maskless Exposure technology is demonstrated to deliver fast and individualized production abilities for micro-optical applications, individual device labelling and micro–structuring of novel RGB–colored photoresists at the die level. Dynamic alignment enables real–time distortion compensation and adaptive repositioning of sub 2μm structures during write–time enabling novel possibilities for heterogenous integration and associated applications.