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The semiconductor traceability is becoming an important subject concerning the overall manufacturing processes, ranging from FEOL, BEOL and packaging processes. The newly developed software "die annotation" feature represents a novel method for the applications in advanced packaging. By applying high resolution dielectrics, the patterned DataMatrix codes down to <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">200μ m× 200μ m</tex> were resolved by maskless exposure technology.
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Varga et al. (2024) studied this question.
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