Approach with Large Panel Fan-Out Technology

This paper demonstrates how 600mm successful using mask-less to solve die shift issues by e-Mask in large Fan Out Panel Level Packaging(600mm*600mm). The demonstrate result of high volume and high yield can be mass production by 600mm process. At ASE, it's a big yield challenges of buildup 600mm first line for production, and it's also the first time in the world. Will be examined of how mask-less system combine with die attach compensation and mold flow overcome the issues to deliver high yield quality. Meanwhile, mask-less provide breakthrough high density devices interface 10/10μm line space for leading silicon nodes will be outline. The capability of mask-less coupled laser direct imaging (LDI) to scale to high density 10 um line & space redistribution layers (RDL) and below will demonstrating industry benchmark performance without the need for complicated embedded chip structures