Large Panel Fan-Out Process for High Performance Computing Device application with Micro Ball Mount Process

While large-scale panel-level packaging is developing, market demand has been restricted. Large size has become both an advantage and a disadvantage. While mass production reduces costs, sufficient forecast is required to keep utilization of the production line. This problem has been solved with the advent of the AI generation. As the demand for high-speed computing arises, the package size becomes larger more large in pursuit of higher performance. Large-size packaging means that it is more suitable for panel-level packaging, the chip sizes ranging from tens of millimeters to hundreds of millimeters, the line utilization rate was be satisfied. Or should we look at it this way, only large-size panels can be mass-produced for large-size packaging. Fan-out packaging has a serval of process combinations and is suitable for manufacturing complex structures that require high-speed computing. Therefore, using large-size fan-out level packaging technology, coupled with the micro-ball process, it enables mass production and low-cost applications.