Large package body size scaling with two novel technologies: Multi Ball BGA and Liquid Metal Interconnect

This paper introduces two novel technologies to address large package body size scaling challenges. Multi Ball BGA (Ball Grid Array) technology is to significantly expand SMT (Surface Mount Technology) process window for BGA packages, addressing bridging and open issues at the same time while not requiring ODM (Original Design Manufacturer) to make equipment and process changes at SMT line. Liquid Metal (LM) Interconnect is a separable interconnect technology with much lower enabling force than traditional LGA (Land Grid Array) socket to allow for continuous pin count scaling. It also has much better electrical contact resistance performance than LGA. Both Multi Ball BGA and Liquid Metal Interconnect technologies can enable package body size beyond 100x100mm to support growing compute demand in HPC and AI processors. As part of Intel IDM 2.0 strategy, we bring these two technology offerings to the market through Intel Foundry.