Takeaway & Assignment of Packaging Technology for Heterogenous + Large Body Packages

For decades, Moore’s Law has driven semiconductor scaling by improving transistor density, performance, and cost efficiency. However, as technology approaches sub-1 nm nodes, physical and economic limitations—including rising design complexity, mask cost, and yield challenges—have slowed this trend, making large monolithic SoCs increasingly unsustainable. Consequently, advanced packaging has emerged as a key driver of system-level scaling, with heterogeneous integration extending Moore’s Law in a “More than Moore” paradigm. This shift enables chiplet-based architectures that integrate logic, memory, and specialized functions within a single package, but also drives rapid increases in package size and complexity. AI and HPC applications demand extreme bandwidth, power, and compute density, relying on technologies such as HBM, 2.5D interposers, and 3D stacking. These advancements introduce significant challenges, including interconnect scaling, thermal management, power delivery, mechanical stress and warpage, yield management, and supply chain constraints. Addressing these issues requires close co-design across silicon, package, and system domains. This work presents an overview of heterogeneous integration and large-body packaging and outlines key technical and economic challenges as future “homework” for enabling scalable solutions in the post-Moore era.