High Performance 3D Heterogeneous Integration Package

Large language & generative model for deep learning training & inference recently drew massive public attentions. The demand of memory size and computing power to process gigantic parameters is beyond imagination. In contrast, the development of transistor shrinking is no longer effective as usual, and to maintain the momentum, it needs more efforts and costs to satisfy the needs. To mitigate the impact, innovative advanced packaging technology is applied. The packaging integration is evolved from 2.5 D and advanced into 3D integration by bringing components closer vertically. Relatively, to accommodate more memories and chiplets in a single package, the size of chip module grows significantly. Furthermore, different CTE of materials & thermal budgets even exacerbate the issues. All in all, how we aware of these problems and solve them is a facing challenge.