Performance Investigation of FinFET Structures: Unleashing Multi-Gate Control through Design and Simulation at the 7 nm Technology Node for Next-Generation Electronic Devices

In this manuscript, we outline a original study that represents the first investigation of its kind, focusing on DC and analog/RF performance of structural flavors of FinFET. A total of six structural variations (D1 to D6 devices) in FinFET as per the IRDS 7 nm technology node specifications is explored here. Through extensive simulations, our findings demonstrate that the incorporation of gate stack, spacer, and source/drain extension concepts in FinFETs leads to superior performance. The DC performance analysis produced near-ideal SS (∼65 mV dec−1) performance, lower leakage currents, improved switching performance, and reduced DIBL values for D3 to D6 devices owing to the incorporation of gate stack, spacer integration, and source/drain extension doping. In terms of analog/RF performance, the best suitable device is found to be D4 device having designed with 1017 cm−3 n-type lightly doped source/drain regions, spacer, and gate stack integrations. A significant improvement such as higher gm, reduced gd, enhanced AV, improved fT, GFP, GTFP, and TFP are obtained for D4 device marking a breakthrough in the FinFET designing. Overall, the findings contribute to the advancement of FinFET at 7 nm technology node, opening up new opportunities for applications in various electronic systems demanding improved device performance.