This paper describes a smart-pixel array technology that is being developed at Honeywell for use in chip-to-chip optical interconnections based on free-space optics. The technology combines large-scale, two-dimensional arrays of optoelectronic and microoptical elements with VLSI electronics to enable high-density, high-speed interchip input/output capability in the optical domain. We have demonstrated prototype modules with 16/spl times/16 and 32/spl times/32 emitter and interleaved detector arrays.
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Liu et al. (2000) studied this question.
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