Rice‐husk‐ash‐based silica as a filler for embedding composites in electronic devices

We carried out a feasibility study of the use of black rice husk ash (RHA) as a filler in epoxy resin for embedding material in electrical and electronic applications. We made a comparison by mixing RHA and two commercial fillers, fused and crystalline silica, with epoxy resin at weight fractions ranging from 20–60%. RHA‐filled epoxy resin had higher mixing viscosity, coefficient of thermal expansion, and water absorption percentage than commercial‐silica‐filled epoxy composite. However, the impact strength of all composites was comparable, but the tensile strength and elongation at break of silica‐filled epoxy were slightly superior.