Micron‐size platinum features are patterned by focusing the output of a CW argon ion laser (514.5 nm) onto a scanning quartz substrate coated with a spun‐on platinum metallo‐organic film. The platinum is used as a seed layer for electroless copper plating. The role of laser power, scan speed, and film thickness on the thermal decomposition of the film is discussed. In addition, the electrochemical activity and composition of the platinum features, as well as their use as seed layer for electroless copper plating, is reported.
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Sausa et al. (1987) studied this question.
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