We propose a low power, high-performance nanoscale (φ = 150 nm) resistive memory device having a Ge2Sb2Te5/Ti/Pr0.7Ca0.3MnO3 (GST/Ti/PCMO) structure. As a thermoelectric heater and/or thermal barrier, GST accelerates the Ti/PCMO interfacial redox process thermally by enhancing the mobility of oxygen ions and minimizes the loss of local heat. Improvement of the memory performances and voltage-time dilemma issue is achieved by adopting this type of thermally assisted process.
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Siddik et al. (2011) studied this question.
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