A stability analysis of metal electrodeposition on a smooth surface has been formulated and applied to copper deposition on a rotating cylinder. Current distribution on a sinusoidal profile was found by a first‐order perturbation technique accounting for ohmic, kinetic, capillary, and concentration overpotentials, and the derived current distribution was used to evaluate the rate of growth or decay of the perturbation. Growth rate was expressed as a function of three dimensionless parameters.
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Barkey et al. (1989) studied this question.