Peridynamic differential operator for transient thermoelastic responses of laminated structures with interface cracks and thermal resistance

Laminated structures are widely used in thermal-shock environments, where material-property mismatch, interfacial thermal resistance, and delamination may cause discontinuous temperature and stress fields. In this study, a dual-phase-lag (DPL) generalized thermoelastic model is established within the framework of the peridynamic differential operator (PDDO) to analyze the transient thermomechanical responses of laminated structures. The proposed formulation retains the nonlocal advantages of peridynamics, accounts for finite-speed heat propagation, and avoids the calibration of bond parameters required in conventional peridynamic models. Interfacial thermal resistance is incorporated through the Kapitza temperature-jump condition, while delamination is represented by a pre-existing adiabatic and traction-free interface crack. The formulation is verified by analytical temperature/stress solutions and convergence studies of temperature, interfacial stress, and dynamic thermal stress intensity factors. Numerical results show that material-property mismatch significantly affects thermal-wave transmission and stress propagation, whereas increasing interfacial thermal resistance enhances temperature jumps, interfacial deformation, and stress concentration. Interface cracks further produce nonuniform fields and pronounced mixed-mode fracture responses under thermal shock.