Investigation on laser-assisted ultra-precision cutting process technology for SiCp/Al composites

Medium-volume-fraction SiCp/Al composites are premier candidates for optical components, yet their application is constrained by severe surface defects like particle pull-out and interfacial debonding. To address these challenges, an optimized laser-assisted machining (LAM) strategy is employed. Distinct from purely mechanical assistants that primarily focus on force reduction, LAM leverages selective thermal softening to create a compliant buffer within the aluminum matrix, thereby reducing the surface roughness Sa to 0.023 µm. Utilizing constitutive models calibrated via quasi-static and high-temperature dynamic tests, finite element analysis reveals that LAM-induced thermal softening of the matrix reduces interfacial stress concentration and suppresses SiCp/Al interfacial debonding, minimizing particle pull-out and subsequent secondary plowing effects. Furthermore, a novel surface quality evaluation scheme utilizing reconstructed three-dimensional point clouds is developed to quantify cavity defects, effectively addressing the limitations of conventional roughness metrics.