An integrated computational framework for thermomechanical assessment of ball grid array layouts in a 3D semiconductor package using COMSOL and ANSYS

Ball Grid Array (BGA) topology affects the thermomechanical reliability of advanced 3D semiconductor packages, specifically regarding heat transfer paths, stress distributions, and package deformation, yet conventional single-response metrics do not account for interconnect utilization and design trade-offs. This study develops an integrated computational framework combining topology-optimized hybrid meshing to achieve mesh independence, benchmark model reconstruction, cross-platform verification between COMSOL Multiphysics and Ansys Mechanical to ensure numerical consistency, and coupled Thermomechanical Analysis (TMA) across nine selected BGA configurations ( P 1 – P 9 ). For these configurations investigated under relatively high heat generation rates, COMSOL Multiphysics and Ansys Mechanical show relative differences below approximately 3.5%. Interconnect-utilization-aware performance indices are introduced by incorporating the number of BGA solder joints into conventional thermomechanical response quantities. Although higher BGA densities generally improve conventional thermal and structural performance, their advantages diminish when interconnect utilization is considered. Within this case study, intermediate layouts reduce the proposed performance indices by up to 53% and 31%, while the corresponding conventional thermomechanical responses deteriorate by only 5.2% and 1.8%, respectively. The proposed framework supports the comparison of the investigated BGA layouts in terms of thermomechanical performance and interconnect utilization, providing a basis for future multi-objective optimization of heterogeneous semiconductor packages.